发明名称 METHOD FOR PACKAGING OPTICAL ELEMENT MODULE
摘要 PROBLEM TO BE SOLVED: To solve such problems that when a conductive material is used for a sponge formed product which is widely used as a packaging material for an optical element module having parts with difficulty for handling such as gratings and loose tubes, the carbon in the conductive material easily drops and this means not only the module can not be carried to a clean room but deterioration in the performance such as short circuits in the module may be caused by the deposition of carbon. SOLUTION: The optical element module is housed in a conductive tray in which a conductive material is kneaded so as to avoid dropping of carbon. An antistatic air cap sheet on which pairs of air bubbles with a little smaller gap than the width of the grating part are arranged is applied so that the grating is interposed between the air bubbles. Then a conductive cover is applied to cap the conductive tray.
申请公布号 JP2002131556(A) 申请公布日期 2002.05.09
申请号 JP20000324001 申请日期 2000.10.24
申请人 MITSUBISHI ELECTRIC CORP 发明人 KONDO TERUHIRO
分类号 G02B6/42;B65D85/86;G02B6/00;(IPC1-7):G02B6/00 主分类号 G02B6/42
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