| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for electroless plating, which reduces the usage of plating solution, maintains a plating process stably, miniaturizes the apparatus, reduces cost, and uniforms film thickness within the surface. SOLUTION: This apparatus comprises a holding means 11 for holding a semiconductor substrate W with an upward-facing surface to be plated, a sheathing member 31 for sealing surroundings of the surface to be plated of the semiconductor substrate W held by the holding means 11, a showerhead 41 for supplying and storing an electroless plating solution on the surface to be plated of the semiconductor substrate W sealed with the sheathing member 31, and a rear-face heater 15 (15-1, 15-2) arranged below the semiconductor substrate W. A space (an area 17 for uniforming temperature) for filling gas therein is provided between the rear face heater 15 and the semiconductor substrate W.
|
