发明名称 |
Method and apparatus for reducing substrate bias voltage drop |
摘要 |
A semiconductor device is provided with a conductive layer provided on a backside of a semiconductor substrate. The conductive layer helps maintain a uniform bias voltage over the substrate. The conductive layer can also be used to apply a bias voltage to the substrate and reduce the number of bias voltage distribution regions required.
|
申请公布号 |
US2002055246(A1) |
申请公布日期 |
2002.05.09 |
申请号 |
US20010998165 |
申请日期 |
2001.12.03 |
申请人 |
JIANG TONGBI;WU ZHIQIANG |
发明人 |
JIANG TONGBI;WU ZHIQIANG |
分类号 |
H01L21/8242;H01L23/482;H01L23/58;H01L27/08;H01L27/108;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/8242 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|