发明名称 Method and apparatus for reducing substrate bias voltage drop
摘要 A semiconductor device is provided with a conductive layer provided on a backside of a semiconductor substrate. The conductive layer helps maintain a uniform bias voltage over the substrate. The conductive layer can also be used to apply a bias voltage to the substrate and reduce the number of bias voltage distribution regions required.
申请公布号 US2002055246(A1) 申请公布日期 2002.05.09
申请号 US20010998165 申请日期 2001.12.03
申请人 JIANG TONGBI;WU ZHIQIANG 发明人 JIANG TONGBI;WU ZHIQIANG
分类号 H01L21/8242;H01L23/482;H01L23/58;H01L27/08;H01L27/108;(IPC1-7):H01L21/44 主分类号 H01L21/8242
代理机构 代理人
主权项
地址