发明名称 |
SEMICONDUCTOR COPPER BOND PAD SURFACE PROTECTION |
摘要 |
Methods for protecting the surface of an uninsulated portion of a copper circuit from environmental contamination detrimental to joining the surface to another metal surface, said method comprising the step of coating the surface with a layer of a ceramic material having a thickness that is suitable for soldering without fluxing and that is sufficiently frangible when the surfaces are being joined to obtain metal-to-metal contact between the surfaces. Coated electronic packages including semiconductor wafers are also disclosed.
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申请公布号 |
US2002054955(A1) |
申请公布日期 |
2002.05.09 |
申请号 |
US19990412542 |
申请日期 |
1999.10.05 |
申请人 |
ELLIS TIMOTHY W.;MURDESHWAR NIKHIL;ESHELMAN MARK A.;RHEAULT CHRISTIAN |
发明人 |
ELLIS TIMOTHY W.;MURDESHWAR NIKHIL;ESHELMAN MARK A.;RHEAULT CHRISTIAN |
分类号 |
H01L21/48;H01L21/60;H01L23/485;H01L23/498;H05K3/28;(IPC1-7):B05D5/12 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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