| 摘要 |
PROBLEM TO BE SOLVED: To provide a porous resin having high heat resistance, dimensional stability and insulating property and having uniform micropores, a photosensitive resin composition for obtaining the porous resin, a circuit board with the porous resin as an insulating layer and a suspension substrate with a circuit. SOLUTION: The photosensitive resin composition 2 contains a polybenzoxazole precursor 4, a photosensitive agent, a compound 3 dispersible in the polybenzoxazole precursor 4 and a solvent. The dispersible compound 3 is dispersed in the polybenzoxazole precursor 4 by removing the solvent from the photosensitive resin composition 2, the dispersible compound 3 is then removed to make the polybenzoxazole precursor 4 porous and the precursor 4 is cured to obtain the porous resin. Since the porous resin has a low dielectric constant, when it is used as the insulating layer 6 of a circuit board, the high-frequency characteristics of the circuit board can be enhanced. |
