| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing which is excellent in strengths under heating, in adhesion to various members such as semiconductor elements and lead frames, in solder resistance during substrate board mounting, and especially in adhesion to preplating frames such as of Ni, Ni-Pd, and Ni-Pd-Au. SOLUTION: This composition contains (A) an epoxy resin, (B) a phenol resin, (C) a compound represented by formula (1) and/or a hydrolyzate of a compound represented by formula (1), (D) an inorganic filler, and (E) a cure accelerator as essential ingredients.
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