| 摘要 |
A method of making a chip scale package comprises the following steps: providing a semiconductor chip having a plurality of metal bumps formed on the active surface thereof; providing a metal plate having a plurality of flip-chip pads formed on a surface thereof; positioning the semiconductor chip on the surface of the metal plate with the metal bumps on the chip aligned with the flip-chip pads on the metal plate; connecting the metal bumps on the active surface of the semiconductor chip to the flip-chip pads on the surface of the metal plate; encapsulating the semiconductor chip against a portion of the surface of the metal plate; removing the metal plate while leaving the flip-chip pads intact; and forming a plurality of solder balls on the flip-chip pads. Using the technique of the present invention, it becomes possible that the manufacture of a molded chip scale package can be relatively simplified and economical, yet highly reliable.
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