FLAME-RETARDANT EPOXY RESIN COMPOSITION AND SEMICONDUCTOR-SEALING MATERIAL USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a flame-retardant epoxy resin composition having excellent flame-retardant properties without using a halogen compound or a phosphorus- based flame retardant; and a semiconductor-sealing material using the same. SOLUTION: This composition contains (A) a nonhalogenated epoxy resin having at least two epoxy groups, (B) a curing agent, (C) and a carbonate as essential ingredients. The semiconductor-sealing material basically comprises the composition and a filler.