| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing in which solder crack resistance is compatible with temperature cycle properties. SOLUTION: This epoxy resin composition contains (A) an epoxy resin, (B) a phenol resin, (C) a cure accelerator, and (D) an inorganic filler in an amount of 85-95 wt.%. The filler contains V wt.% spherical fused silica having an average particle size of 1-80μm and a particle size distribution wherein particles having particle sizes of 0.2μm or smaller occupy 10 wt.% or less and particles having particle sizes of 150μm or larger occupy 3 wt.% or less and W wt.% spherical alumina having an average particle size of 1-40μm and a particle size distribution wherein particles having particle sizes of 0.2μm or smaller occupy 3 wt.% or less and particles having particle sizes of 100μm or larger occupy 3 wt.% or less, provided the compounding ratio V/(V+W) is 0.5-0.95. The composition gives a cured item having a coefficient of linear thermal expansionαof 0.7×10-5-1.7×10-5 (/ deg.C). |
