| 摘要 |
PROBLEM TO BE SOLVED: To provide plating equipment which improves uniformity of plated film thickness within a plated surface without increasing burden on plating. SOLUTION: This equipment comprises arranging an electrolysis diaphragm between an anode electrode and an electroconductive layer of a substance to be treated for separating a plating liquid and making the electrical sheet resistance or the film thickness between front and back interfaces of the electrolysis diaphragm differ depending on the site. Those values are made to be almost concentrically higher as the site is more distant from the center. The equipment thereby uniforms plated film thickness on the treated surface of the substance, because the electrical resistance of the plating liquid and electrolysis diaphragm between a surface of the anode electrode and each part of the conductive layer of the substance to be treated, is higher, and the passing current is lower, as the site is nearer to circumference of the substance. As there is no structure obstructing flow of the plating liquid, there is no necessity of spouting a larger quantity of plating liquid.
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