| 摘要 |
PURPOSE: To provide a method of manufacturing a semiconductor device which is reduced in mounting area and manufacturing cost and capable of eliminating mounting troubles by symmetrically arranging back electrodes. CONSTITUTION: A board 21 equipped with many mounts is prepared. Semiconductor chips 33 are each mounted on the mounts and covered with a resin layer 35, and the semiconductor chips 33 are divided into separate semiconductor devices by separating the mounts into separate pieces. Outer electrodes 31a to 31d, electrically connected to the electrodes of the semiconductor chips 33, are arranged on the rear of the insulating board 21. The outer electrodes 31a to 31d are arranged symmetrical to each other about the center lines 41 and 42 of a package. |
