PRECISION MACHINING DEVICE WITH ATTITUDE CONTROL DEVICE AND ATTITUDE CONTROL METHOD

摘要

PROBLEM TO BE SOLVED: To provide a precision machining device with an attitude control device and its attitude control method for machining articles including a silicon wafer, requiring extremely precise shaping accuracy and finished surface roughness. SOLUTION: The precision machining device with the attitude control device comprises a grinding wheel and its rotating device and a work and its rotating device placed on individually independent tables and a grinding wheel spindle and a work spindle arranged to be coaxially opposed to each other, wherein an attitude control plate is provided one of the two tables, the attitude control plate being simultaneously rotatable around a contact C as a supporting point at a minute angle toward any space and the attitude control plate having minute-angle rotation utilizing the minute displacement of a super magnetostrictive actuator. In attitude control, a control system employing a hysteresis model is used to compensate for the hysteresis characteristic of a super magnetostrictive element of the super magnetostrictive actuator.