发明名称 Device comprising an electrical circuit carried by a carrier element and method for the manufacture of such a device
摘要 <p>A device includes an electrical circuit carried by a carrier element (T), an electrically conductive structure (TF) being provided on a surface of the carrier element (T). In accordance with the invention the one or more components (C1,C2) of the electrical circuit are arranged on the side of the electrically conductive structure (TF) facing the carrier element (T). Such a device is more versatile in use and can be made more compact than is the case with conventional arrangements. A method of producing such a device comprises the following steps: application of the electrically conductive structure (TF) to a temporary substrate (TS), mounting of further components (C1,C2) of the electrical circuit on the electrically conductive structure (TF), application of a composition forming the carrier element (T) to the side of the temporary substrate (TS) carrying the said circuit parts (C1,C2), and removal of the temporary substrate (TS). <IMAGE></p>
申请公布号 EP1204305(A2) 申请公布日期 2002.05.08
申请号 EP20010124954 申请日期 2001.10.19
申请人 TYCO ELECTRONICS AMP GMBH 发明人 AMMAN, NORBERT;PREYSS, WALTER
分类号 H01L25/00;H01L21/56;H01L21/60;H05K1/18;H05K3/20;(IPC1-7):H05K3/20 主分类号 H01L25/00
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