Verfahren und Vorrichtung zum Polieren von Werkstücken

摘要

A polishing apparatus for polishing a workpiece such as a semiconductor wafer (4) has a turntable (5) with an abrasive cloth (6) mounted on an upper surface thereof, and a top ring (1) for holding a workpiece (4) and pressing the workpiece (4) against the abrasive cloth (6) under a first pressing force to polish the workpiece (4). A guide ring (3) is vertically movably disposed around the top ring (1), and pressed against the abrasive cloth (6) under a variable second pressing force. The first and second pressing forces are variable independently of each other, and the second pressing force is determined based on the first pressing force.