| 发明名称 |
USE OF AN ETCHING SOLUTION, CONTAINING HYDROFLUORIC ACID |
| 摘要 |
This invention relates to etching solutions which comprise hydrofluoric acid and organic solvents for use in the process for the production of integrated circuits. The etching solutions according to the invention are particularly suitable for the selective etching of doped silicate layers. |
| 申请公布号 |
EP1203404(A1) |
申请公布日期 |
2002.05.08 |
| 申请号 |
EP20000956166 |
申请日期 |
2000.07.05 |
| 申请人 |
MERCK PATENT GMBH |
发明人 |
WIEGAND, CLAUDIA;RHEIN, RUDOLF;TEMPEL, EBERHARD |
| 分类号 |
C09K13/08;H01L21/308;H01L21/311;(IPC1-7):H01L21/311 |
主分类号 |
C09K13/08 |
| 代理机构 |
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