发明名称 APPARATUS AND METHOD FOR CLAMPING MOLD AND METHOD FOR REGULATING MOLD THICKNESS USING SAME APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide an apparatus for clamping a mold capable of manufacturing at a low cost with few components, and to provide a method for regulating a mold thickness for reducing a waste time for eliminating a loose gap between a ring groove of a tie bar and an engaging teeth of a half nut in association with the regulation of the mold thickness. SOLUTION: A mold clamping means for coupling and pressurizing a moving die plate 9 to a fixed die plate 5 via a tie bar 15 has a mold clamping cylinder having two stages of a large-diameter cylinder 12 and a small-diameter cylinder 31, and a ram formed at two stages of a large-diameter ram 13 and a small- diameter ram 25. The ram 13 is inserted into the cylinder 12, and the ram 25 is inserted into the cylinder 31. A base of the bar 15 is directly coupled to the ram 25. Large oil chambers are provided at both sides of the ram 13, and a small oil chamber is provided at the time bar coupling side of the ram 25. Oil pressure supply means for suitably supplying hydraulic pressures to the large oil chambers and the small oil chamber of the cylinders to suitably move the bar 15 is provided.
申请公布号 JP2002127216(A) 申请公布日期 2002.05.08
申请号 JP20000322175 申请日期 2000.10.23
申请人 MITSUBISHI HEAVY IND LTD 发明人 KUBOTA KOJI;FUJITA SABURO;SUGITA TOSHIMICHI
分类号 B29C45/67;B29C45/76;B29C45/80;(IPC1-7):B29C45/67 主分类号 B29C45/67
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