发明名称 MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a molding method which can expand molding conditions by preventing the generation of defective molding by making a molding material melt uniformly and enlarging the range of moldable materials. SOLUTION: A granular resin molding material 2 is supplied into a pot 1. The supplied molding material 2 is compressed between a pressure adjustment plunger 6 and an injection plunger 3. After that, the compressed molding material 2 in the pot 1 is injected into a cavity through a runner 4 by the injection plunger 3. The molding material 2 in the pot 1 is heated from the center side of the pot 1. Heat can be transmitted easily to the inside of the molding material 2 so that the molding material 2 can be melted uniformly.
申请公布号 JP2002127176(A) 申请公布日期 2002.05.08
申请号 JP20000327736 申请日期 2000.10.26
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 NAKAMURA HITOSHI
分类号 B29C45/02;B29C45/72;H01L21/56;(IPC1-7):B29C45/02 主分类号 B29C45/02
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