SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor package is provided to achieve high integration and high capability of a small-size similar to that of a semiconductor chip. CONSTITUTION: A plurality of bond pads(12) are formed on the semiconductor chip(11). A polyimide film(13) is attached to a portion of the upper surface of the semiconductor chip except the bond pad. A plurality of conductive pads and a plurality of conductive lands are formed in the polyimide film and connected to each other by using the circuit patterns. A plurality of wires(16) connect the bond pads of the semiconductor chip with the conductive pad of the polyimide film. A plurality of bumps(14) are melted and attached to the conductive lands formed on the polyimide film to draw out a signal. A resin material surrounds the semiconductor chip and the polyimide film to protect the semiconductor chip and the polyimide film from the oxidation and corrosion due to the external ambience.