MOLDING DIE OF AREA ARRAY BUMPED SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A molding die of an area array bumped semiconductor package is provided to improve cohesion of solder balls by forming a solder ball settling groove near a protrusion of a lead. CONSTITUTION: The protrusions of the lead(32) is of an array type, disposed on the bottom surface of a semiconductor package. After the semiconductor package is molded, a protrusion(36a) is formed in the position of the protrusion of the lead so that the solder ball settling groove is formed in the protrusion of the lead. A groove is formed in the center of the protrusion.