发明名称 EMBOSS PROCESSING RESIN FILM
摘要 PROBLEM TO BE SOLVED: To provide an individual packaging film with the coefficient of dynamic friction of 1.0 or more excellent in supply and discharge properties. SOLUTION: An emboss processing resin film is obtained by guiding a thermoplastic resin film to the gap between a carving roll, which has a regular embossed pattern with a wire gauge of 150-220 applied to the surface thereof, and a rubber roll. The emboss patterns of the film surface (front side surface) coming into contact with the carving roll of the emboss processing resin film show the trough parts of the inverted emboss patterns surrounded by regular ridge lines and the emboss patterns of the film surface (rear side surface) coming into contact with the rubber roll show the ridge patterns of the regular emboss pattern and the ridge lines of the surface film have the inner width enabling the tops of the ridge parts of the rear side surface film to fit in the trough parts of the inverted emboss patterns surrounded by the ridge lines of the surface film.
申请公布号 JP2002127246(A) 申请公布日期 2002.05.08
申请号 JP20000369229 申请日期 2000.10.30
申请人 DAIYA PLASTIC KK 发明人 YAZAKI TAKAO;OKANO KATSUJI
分类号 B32B27/00;B29C59/04;(IPC1-7):B29C59/04 主分类号 B32B27/00
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