| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for cleaving capable of cleaving in good positional and working accuracies by easily handling. SOLUTION: The apparatus for cleaving comprises a moving stage 2 moving on a fixed state 1 in a state in which an LSI chip 4 to be cleaved is mounted on the stage 1, a cleaving cutter 3 stood on the stage 1 capable of being contacted with the chip 4 mounted on the stage 2, and a cleaving unit 5 for pushing out the chip 4 mounted on the stage 2 toward the cutter 3.
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