| 发明名称 |
Conductive pattern producing method |
| 摘要 |
An improved method of forming an electrode pattern on a substrate is described. The substarate is coated with a first conductive film and subjected to baking. On the first conductive film is then overlied a second conductive film which mends possible fissures of the first conductive film which, besides, would produce open circuits in the pattern.
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| 申请公布号 |
US6383327(B1) |
申请公布日期 |
2002.05.07 |
| 申请号 |
US19940219853 |
申请日期 |
1994.03.30 |
| 申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
MASE AKIRA |
| 分类号 |
H01L21/60;G02F1/13;G02F1/1343;G02F1/1345;H01L21/48;H05K1/09;H05K3/24;(IPC1-7):H05K3/30 |
主分类号 |
H01L21/60 |
| 代理机构 |
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