发明名称 Coated film forming apparatus
摘要 Provided is a coating film forming apparatus capable of shortening an operating time without considerably altering the design of the apparatus and changing the physical properties of a material such as a resist solvent. A spin coater for spreading a coating solution 5 dropped onto a substrate 1 to be coated over the substrate 1 to be coated by the centrifugal pump action performed with the rotation of the substrate 1 to be coated and for evaporating a solvent in the coating solution 5 to form a coating film on the substrate 1 to be coated, a tank 14 for storing the coating solution, and a housing case 15 for accommodating the substrate to be coated are provided in a casing P, and the casing P is provided in a cleaning room. A temperature in the casing P is set higher than a temperature in the clean room on the outside of the casing P by using temperature control devices 30, 31, 32 and 33. Consequently, an operating time can be shortened.
申请公布号 US6383294(B1) 申请公布日期 2002.05.07
申请号 US19990471495 申请日期 1999.12.23
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 NAKAMURA YOSHIAKI;OMINE TOSHIMITSU
分类号 H01L21/00;(IPC1-7):B05C13/00;B05B1/24 主分类号 H01L21/00
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