发明名称 Methods and apparatus for obtaining a connection characteristic of a connection assembly
摘要 The invention is directed to techniques for obtaining a connection characteristic (e.g., pin wipe) of a connection assembly having a first set of contacts (e.g., pin-receiving contacts of circuit board connectors) and a second set of contacts (e.g., pins of backplane connectors) using less destructive approaches than a conventional disassembly approach. In particular, the invention does not rely on disassembling a backplane from a card cage and cutting connectors. Rather, in one arrangement, the invention uses a test structure in place of a normal operating circuit board. The test structure includes a support member (e.g., circuit board material) that supports the first set of contacts, and that is capable of moving relative to the second set of contacts. The test structure further includes a detection circuit, coupled to the support member, that detects an electrical event resulting from movement of the first set of contacts relative to the second set of contacts (e.g., making electrical contact between the first and second sets of contacts). The test structure also includes a measuring device, coupled to the support member, that identifies position coordinates resulting from movement of the first set of contacts relative to the second set of contacts. The measuring device enables a user to identify (i) a first position coordinate in response to the electrical event resulting from movement of the first set of contacts relative to the second set of contacts, and (ii) a second position coordinate in response to a mechanical event resulting from movement of the first set of contacts relative to the second set of contacts (e.g., the first set of contacts reaching a fully seated position relative to the second set of contacts). A difference between the first and second position coordinates provides the connection characteristic of the connection assembly. Preferably, the test structure is reusable and portable, and can be used to measure connection characteristics of products in a manufacturing assembly line, or out in the field (e.g., at customer sites).
申请公布号 US6385551(B1) 申请公布日期 2002.05.07
申请号 US20000609966 申请日期 2000.07.05
申请人 EMC CORPORATION 发明人 RIENZO FRANK
分类号 H05K7/14;(IPC1-7):A47B97/00 主分类号 H05K7/14
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