| 摘要 |
A coated substrate for plumbing applications in which the leaching of metals into water contacting the substrate is significantly reduced, comprises an alloy having copper has a majority constituent and also comprising tin, zinc and lead; and a coating having a thickness in a range from 0.4 to 1.2 mils upon the substrate, the coating further comprising a mixture of an cationic epoxy resin material and a curing agent for said cationic epoxy resin material. The coating is preferably applied by electrodeposition and then cured by baking in an oven at approximately 400° F. for about twenty minutes.
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