| 摘要 |
A heat sink structure includes a lower heat sink in thermal contact with a heat emitting component. The heat sink structure further includes an upper heat sink and at least one heat pipe extending from the lower heat sink to the upper heat sink. At least one spring urges the upper heat sink away from the lower heat sink and into thermal contact with a cabinet, sometimes called a cover or a lid, of a computer system. During use, the heat emitting component generates heat. This heat is conducted to the lower heat sink, the upper heat sink, and the cabinet. The cabinet dissipates heat to the outside of the computer system.
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