发明名称 Boiling cooling system that exchanges heat between higher-temperature fluid and lower-temperature fluid
摘要 There is provided a boiling cooling system that exchanges heat between a higher-temperature fluid and a lower-temperature fluid through boiling heat transfer of a refrigerant sealingly contained within the boiling cooling system. The boiling cooling system includes a heat absorbing unit, a heat radiating unit, a vapor transfer pipe and a liquid return pipe. The refrigerant in the liquid state generally fills up to a top of an interior space of an upper tank of the heat absorbing unit and also generally fills up to a top of an interior space of a lower tank of the heat radiating unit while the boiling cooling system is not operated.
申请公布号 US6382308(B2) 申请公布日期 2002.05.07
申请号 US20010851307 申请日期 2001.05.08
申请人 DENSO CORPORATION 发明人 OKAMOTO YOSHIYUKI
分类号 F24F5/00;F25B23/00;F28D15/02;H05K7/20;(IPC1-7):F28D15/00 主分类号 F24F5/00
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