| 摘要 |
A hot melt composition for electronic components comprising as main components about 10 to 40 % by weight of polyolefin wax, about 5 to 15 % by weight of butene-propylene copolymer, about 2 to 40 % by weight of dicyclopentadiene (DCPC) and about 0.1 to 5 % by weight of polybutene. The competition according to the invention has an excellent extension strengh at lower temperature as well as higher temperature, which is required for manufacturing the circuit wafers for electric or electronic components, especially for monitors, and has an improved cold resistance, stability at high temperature, and heat-resistance when compared to the conventional hot melt composition. Therefore, the composition may be useful for manufacturing the electronic components. |
