| 摘要 |
A laser system (100) comprises a laser handler (115) for providing laser beams (132, 160) from one or more laser sources (120, 125); an optical system handler (135) for manipulating the laser beams and directing one or more manipulated beams (165) at a scribing lanes of a semiconductor wafer (145); and a wafer handler (140) for aligning and moving the wafer (145) relative to the one or more manupulated beams (165). A controller (130) automatically selects laser sources and optical elements appropriate to the type of wafer to be cut, and controls the movement of the wafer. The system is flexible, being able to server wafers of a variety of materials and thicknesses. |
