发明名称 |
METAL SURFACE PROCESS APPARATUS AND METAL SURFACE PROCESS METHOD USING APPARATUS |
摘要 |
<p>PURPOSE: A metal surface process apparatus and a metal surface process method using the same are provided to prevent the generation of sludge, thus reducing the rate of inferior goods, to continuously maintain the speed of grinding, and to effectively manage a plating solution. CONSTITUTION: The metal surface process apparatus comprises: an electro bath(21); an electrolyte(24) received in the electro bath; an anode plate(22) immersed in the electrolyte; a cathode plate(23) immersed in the electrolyte; and an isolation plate(200) installed between the anode plate and the cathode plate so as to selectively pass only predetermined ion molten in the electrolyte through its fine holes during the process of electrolysis.</p> |
申请公布号 |
KR20020032782(A) |
申请公布日期 |
2002.05.04 |
申请号 |
KR20000063436 |
申请日期 |
2000.10.27 |
申请人 |
SAMSUNG TECHWIN CO., LTD. |
发明人 |
HAN, MUN HO;JANG, BAE SUN;PARK, SE CHEOL |
分类号 |
C25F3/30;C25B9/08;C25C1/00;C25F3/16;C25F7/00;H01L23/50;(IPC1-7):C25C1/00 |
主分类号 |
C25F3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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