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发明名称
INSULATING RESIN COMPOSITION FOR MULTILAYER PRINTED WIRING BOARDS, MULTILAYER PRINTED WIRING BOARDS MADE BY USING THE COMPOSITION AND PROCESS FOR THE PRODUCTION THEREOF
摘要
申请公布号
KR20020033190(A)
申请公布日期
2002.05.04
申请号
KR1020027003734
申请日期
2002.03.21
申请人
发明人
分类号
C08L63/00
主分类号
C08L63/00
代理机构
代理人
主权项
地址
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