WIRE BONDING STRUCTURE AND METHOD

摘要

PURPOSE: A wire bonding structure and a related method are provided to allow an overlapped bonding of two conductive wires onto a conventional-sized single input/output pad of a semiconductor chip, and thereby to meet a need for fine pitch of the semiconductor chip. CONSTITUTION: To realize the overlapped bonding, the first conductive wire(1) is ball-bonded at one end to a lead(21) of a substrate(20), and switch-bonded at the other end to a specific one of input/output pads(11) of the semiconductor chip(10). In addition, the second conductive wire(2) is ball-bonded at one end to the specific input/output pad(11), and switch-bonded at the other end to another lead(22) of the substrate(20). That is, on the specific input/output pad(11), the ball-bonded end(b) of the second wire(2) covers the switch-bonded end(s) of the first wire(1).