| 摘要 |
PURPOSE: A heater block for semiconductor wire bonding is provided to use chips and lead frames of various sizes in a wire bonding process by controlling intervals of a block for loading a chip and a block for loading a lead. CONSTITUTION: A heater block is formed with a main block(32), a couple of control block(35), and a loading/unloading portion. The main block(32) is formed with a chip block(33) and a guide rail(34). A semiconductor chip is loaded on an upper face of the chip block(33). The guide rail(34) is extended and projected from both sides of the chip block(33). A lead frame is loaded on an upper face of the control block(35). A guide groove is formed on a bottom face of the control block(35). The guide rail(34) is inserted into the guide groove. The control blocks(35) are loaded on the guide rail(34) of both sides of the chip block(33). The loading/unloading portion is used for loading or unloading the control block(35) on or from a predetermined position of the guide rail(34). |
