MODULE COMPONENT, PACKAGING STRUCTURE OF IT, AND ELECTRONIC DEVICE

摘要

PURPOSE: To provide a module component and an electronic device using the same capable of lowering height of the module component itself, and thinning total thickness of the circuit part including the module component with the module component mounted and a mother board. CONSTITUTION: The module component 30 comprises the high component 12 capable of being packaged in a first concave notch 11a of the component- mounting board 11, and the component-mounting board 11 itself capable of being packaged in a second concave notch 32a of the mother board 32. Therefore, with the module component 30 mounted on the mother board 32, the total thickness of the circuit part with the module component mounted can be thinned up to the thickness of the component-mounting substrate 11 plus the thickness of the mother board 32.