| 摘要 |
PURPOSE: A wet etch apparatus for fabricating a semiconductor is provided to prevent contamination of a wafer in a wet etch process by intercepting a contact between a back face of a wafer and an etching solution. CONSTITUTION: A catch cup is formed in an inside of a process chamber(1). A wafer stage(100) is installed in an inside of the catch cup to absorb a wafer. The first drive arm(7a) and the second drive arm include the first nozzle(8a), the second nozzle(8b), the third nozzle, and the fourth nozzle in order to inject deionized water, a nitrogen gas, and an etching solution to a front face of the wafer. The fifth nozzle(8e) is used for injecting the deionized water to a back face of the wafer. A sealing portion is used for sealing the back face of the wafer and a wafer loading face(101) of the wafer stage(100) to prevent a contact between the injected etching solution and the back face of the wafer.
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