LEAD FRAME FOR FABRICATING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A lead frame for fabricating a semiconductor package is provided to prevent a bonding error in a wire bonding process by improving a structure of an inner lead of the lead frame. CONSTITUTION: A semiconductor chip is adhered to a die pad(2). A plurality of inner leads(1) are arranged around the die pad(2). A tie bar(3) is used for supporting the die pad(2). An outer lead is formed by extending the inner lead(1) to an outside. A dam bar is located between the inner lead(1) and the outer lead. An upper face of the inner lead(1) has a width of a wire bonding region larger than the width of the remaining region except for the wire bonding region by improving the shape of the inner lead(1). A lower face of the inner lead(1) has a width expanded from a lead tip. A lead lock tape(4) is adhered on a clamping region of the inner lead(1) in order to maintain an interval between the inner leads.