STRUCTURE OF PRINTED CIRCUIT BOARD FOR FABRICATING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A structure of a printed circuit board for fabricating a semiconductor package is provided to prevent a diffusion phenomenon of a solder in a flip chip bonding process by improving a structure of a printed circuit board for flip chip package. CONSTITUTION: A printed circuit board a resin layer for forming a core, a metal trace(2) having a predetermined pattern formed on the resin layer, and a solder mask(4) formed on an upper face of the remaining resin layer except for a bonding pad portion(3) of the metal trace(2). The metal trace(2) is formed by a Cu material. Titanium(5) is coated on the remaining portion except for the binding pad portion(3) of the metal trace(2). A diffusion process of a solder coated on the bonding pad portion(3) to a lower region of the solder mask(4) of the metal trace(2) is prevented by coating the titanium(5) on the remaining portion except for the bonding pad portion(3) of the metal trace(2).