MAGAZINE FOR RECEIVING SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A magazine for receiving a semiconductor package is provided to prevent a damage of a lead frame by shifting stably a weight block and removing a jamming phenomenon. CONSTITUTION: A holder(100) of a magazine is formed with a plurality of frames(102,104) and a connection plate. A back face of the holder(100) is welded by the connection plate. A front face of the holder(100) has an opened structure. A lead frame receipt portion(112) for receiving a lead frame is formed in an inside of the holder(100). A stopper(114) is installed in both sides(111,113) of the holder(100). A weight block(200) is located on a bottom face of the lead frame receipt(112). The weight block(200) is used for supporting a weight of laminated lead frame. The weight block(200) is contacted with an elevator bar. A guide groove(120) is formed in the both sides of the holder(100).