| 摘要 |
PURPOSE: A method of depositing substantially continuous seed layers is provided to conform to surface geometries in electronic devices, particularly in devices having very small geometries such as 0.5 micron and below. CONSTITUTION: A method for depositing a seed layer includes the steps of: contacting a substrate having a conductive layer and apertures of <=1 mum with an electroless copper plating bath; subjecting the substrate to a low current density for a period of time to initiate plating of copper on the conductive layer; discontinuing the current; and continuing to plate electrolessly to provide a copper seed layer.
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