Method of manufacturing a metal frame, metal frame and using the same

摘要

The method involves forming a recess(es) in the metal frame (1) surface (3) on at least one contact surface by forming a bead on the surface around the recess (2) by displacing material, applying a ram to the bead whose surface placed on the bead is plane parallel to the surface of the metal frame and applying pressure perpendicularly to the bead with the ram and smoothing the surface by forming an annular retention fold from the bead material. Independent claims are also included for the following: a metal bearer frame and its use as a semiconductor bearer.