ALLOY FOR SOLDER AND SOLDER JOINT

摘要

An alloy for solder having a chemical composition: Zn: 3.0 to 14.0 wt %, Al: 0.0020 to 0.0080 wt %, and balance: Sn and inevitable impurities; an alloy for solder having a chemical composition: Zn: 3.0 to 14.0 wt %, Bi: 3.0 to 6.0 wt %, Al: 0.0020 to 0.0100 wt %, and balance: Sn and inevitable impurities; and a solder joint in electric or electronic equipment which comprises the alloy for solder. The alloy for solder has no adverse effect on the environment and exhibits good solderability comparable to that of a conventional Pb-Sn solder.