发明名称 |
Substrate processing apparatus |
摘要 |
A removal liquid is supplied to a substrate on which a thin film formed is patterned by dry etching using a resist film as a mask, and cleaning is made with de-ionized water, thereby removing a reaction product generated on the surface of the substrate. After that, the processed substrate is heated, thereby completely drying the substrate from which the reaction product has been eliminated.
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申请公布号 |
US2002051644(A1) |
申请公布日期 |
2002.05.02 |
申请号 |
US20010984533 |
申请日期 |
2001.10.30 |
申请人 |
DAINIPPON SCREEN MFG. CO., LTD. |
发明人 |
SUGIMOTO HIROAKI;OKUDA SEIICHIRO;KURODA TAKUYA |
分类号 |
G03F7/30;H01L21/00;(IPC1-7):G03D3/00 |
主分类号 |
G03F7/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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