发明名称 Substrate processing apparatus
摘要 A removal liquid is supplied to a substrate on which a thin film formed is patterned by dry etching using a resist film as a mask, and cleaning is made with de-ionized water, thereby removing a reaction product generated on the surface of the substrate. After that, the processed substrate is heated, thereby completely drying the substrate from which the reaction product has been eliminated.
申请公布号 US2002051644(A1) 申请公布日期 2002.05.02
申请号 US20010984533 申请日期 2001.10.30
申请人 DAINIPPON SCREEN MFG. CO., LTD. 发明人 SUGIMOTO HIROAKI;OKUDA SEIICHIRO;KURODA TAKUYA
分类号 G03F7/30;H01L21/00;(IPC1-7):G03D3/00 主分类号 G03F7/30
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