| 摘要 |
A method for determining whether a process having a small or large proportion of process features is in control by reviewing only small samples. The method comprises a data review and charting technique that readily identifies when a process is beginning to stray beyond acceptable control parameters so that corrective action may be initiated at an early stage before substantial output is affected. The method is applicable to any process sought to be reviewed, but is particularly useful with semiconductor wafer processing, such as wafer polishing
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