| 摘要 |
The portion of a polishing element (7) that sticks out to a wafer's surrounding from the wafer (2) being polished is supported by the guide surface (5a) of an annular guide member (5), the guide surface (5a) being positioned in almost the same plane as the polishing surface of the wafer (2). The guide member (5) is attached to a member (13) via a bearing and is rotatably supported coaxially with and independently of a retaining unit (3) holding the wafer (2). The guide member (5) is driven by the sticking-out portion of the polishing element (7) by a friction force received therefrom. As a result, a relative speed between the sticking-out portion of the polishing element (7) and the guide member (5) is very low to reduce a friction therebetween. |
