ELECTRONIC COMPONENT, COMPONENT MOUNTING EQUIPMENT, AND COMPONENT MOUNTING METHOD
摘要
The component mounting equipment (30) mounts an FPC board (12) on an LCD board (11). The LCD board (11) has a first electrode section (11b) on one side edge and a second electrode section (11c) on another side edge. The FPC board (12) has a first section (12a) on one side edge and a second section (12b) on other side edge. A first mounting apparatus (31) mounts the first section (12a) on the first electrode section (11b). A second mounting apparatus (32) mounts the second section (12b) on the second electrode section (11c). In the second component mounting apparatus (32), the second section (12b) is separated from the second electrode section (11b) at an ACF supply section (170) and released at a pre-press bonding section (180).
申请公布号
WO0235903(A2)
申请公布日期
2002.05.02
申请号
WO2001JP09265
申请日期
2001.10.23
申请人
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;NISHINO, KENICHI;KANAYAMA, SHINJI;TSUJI, SHINJIRO;IDA, MASAYUKI;NISHIMOTO, TOMOTAKA