| 摘要 |
An integrated circuit device having a chip-on-chip structure comprises a first IC chip, a second IC chip arranged on the first IC chip with surfaces of the first and second IC chips facing each other and electrically connected to the first IC chip by way of bonding, one or more conductor materials, and a substrate to which an electric potential is given and on which the first and second IC chips are mounted, wherein the conductor material is arranged either between the first and second IC chips or on an opposite surface of the second IC chip to the surface facing the first IC chip, and electrically connected to the substrate so as to provide a shielding effect for reducing malfunctions of the device that are caused by noise.
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