发明名称 |
Substate arrangment and element connected thereto |
摘要 |
The arrangement has a substrate (1) and a connecting element (2) with a one-piece comb-shaped arrangement of solder connections (4) that is electrically connected to the substrate with the solder connections. The connecting element is connected to a high current contact element (3) in one piece using the comb-shaped arrangement of solder connections. |
申请公布号 |
EP1202615(A1) |
申请公布日期 |
2002.05.02 |
申请号 |
EP20010125262 |
申请日期 |
2001.10.24 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
ALLWANG, REINHARD |
分类号 |
H01R12/70;H05K1/02;H05K3/34 |
主分类号 |
H01R12/70 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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