| 摘要 |
An optoelectronic element module is provided, which has improved reliability in cooling performance. This module is comprised of an optoelectronic element (1), a Peltier unit (6) for cooling the optoelectronic element, and a package (5) encapsulating the optoelectronic element and the Peltier unit. The optoelectronic element is mounted directly on or indirectly through a supporting member (2,3) on a first surface (6c) of the Peltier unit (6). A second surface (6b) of the Peltier unit is engaged with a mounting surface (5aa) of the package (5) by an engaging structure (13a,13b,14) while allowing the Peltier unit (6) to shift along the mounting surface (5aa) of the package (5). A thermal stress caused by a difference between thermal expansion coefficients of the second surface (6b) of the Peltier unit (6) and the mounting surface (5aa) of the package is relaxed by a positional shift of the Peltier unit (6) along the mounting surface (5aa) of the package with respect to the package. Preferably, the engaging structure produces a magnetic-field force or elastic force for engagement. <IMAGE> |
