A device and a method for electroless plating; the device capable of easily forming a plating film of uniform thickness on the plated surface of a plated material, comprising a holding part (10) having a heating part (14) and holding the plated material with the plated surface facing downward and a plating bath (24) allowing electroless plating solution (22) with a specified temperature to lead into a plating chamber (28) and holding the solution while allowing the solution to overflow from an overflow weir, wherein the plated material held by the holding part (10) is brought into contact with the plating solution (22) in the plating bath (24) for plating the plated material.
