APPARATUS FOR PROVIDING HEAT DISSIPATION FOR A CIRCUIT ELEMENT

摘要

An arrangement for dissipating heat from a circuit element attached to a printed circuit board, comprising: a heatsink having a pair of arms, each one of the arms having tips including bumps, and a structure coupled to the printed circuit board on at least two sides. The structure has holes structured and arranged to allow each of the bumps on the tips of the arms to fit into the holes of the structure.